SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 9, 2009, Pages 1866-1873

Constitutive relations for creep in a SnCu-based composite solder reinforced with Ag particles

(7) Shi, Yaowu a Yan, Yanfu a Liu, Jianping a Xia, Zhidong a Lei, Yongping a Guo, Fu a Li, Xiaoyan a

a BEIJING UNIVERSITY OF TECHNOLOGY (China)

Author keywords

Composite solder; Constitutive relation; Creep; Lead free; Sn 0.7Cu

Indexed keywords

AG PARTICLES; COMPOSITE SOLDER; COMPOSITE SOLDERS; CONSTITUTIVE RELATION; CONSTITUTIVE RELATIONS; CREEP DEFORMATION MECHANISMS; CREEP STRAIN; CU-BASED COMPOSITES; LEAD-FREE; LOAD CREEP TESTS; SINGLE SPECIMEN; SN-0.7CU; SN-0.7CU SOLDER; SOLDER JOINTS; STEADY STATE CREEP RATE; STRESS EXPONENTS;

ACTIVATION ENERGY; BRAZING; CREEP; CREEP RESISTANCE; LEAD; SILVER; WELDING;

TIN;

EID: 68949147560 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0840-1 Document Type: Article

Times cited : (16)

References (21)

1
- 0035008111
- Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints
- DOI 10.1023/A:1011264527894
- F. Guo J.P. Lucas K.N. Subramanian 2001 J. Mater. Sci. Mater. Electron. 12 27 10.1023/A:1011264527894 (Pubitemid 32471237)
- (2001) Journal of Materials Science: Materials in Electronics , vol.12 , Issue.1 , pp. 27-35
- Guo, F.¹ Lucas, J.P.² Subramanian, K.N.³

2
- 0035455149
- 10.1007/s11664-001-0132-x
- F. Guo J. Lee S. Choi J.P. Lucas T.R. Bieler K.N. Subramanian 2001 J. Electron. Mater. 30 1073 10.1007/s11664-001-0132-x
- (2001) J. Electron. Mater. , vol.30 , pp. 1073
- Guo, F.¹ Lee, J.² Choi, S.³ Lucas, J.P.⁴ Bieler, T.R.⁵ Subramanian, K.N.⁶

3
- 0032206792
- 10.1007/s11664-998-0072-9
- H. Mavoori S. Jin 1998 J. Electron. Mater. 27 1216 10.1007/s11664-998- 0072-9
- (1998) J. Electron. Mater. , vol.27 , pp. 1216
- Mavoori, H.¹ Jin, S.²

4
- 28444449853
- IEEE
- K. Mohankumar and A.A.O. Tay, Proceedings of 6th Electronics Packaging Technology Conference, IEEE, pp. 455-461 (2004).
- (2004) Proceedings of 6th Electronics Packaging Technology Conference , pp. 455-461
- Mohankumar, K.¹ Tay, A.A.O.²

5
- 4944261402
- 10.1007/s11664-004-0022-0
- J.P. Liu F. Guo Y.F. Yan W.B. Wang Y.W. Shi 2004 J. Electron. Mater. 33 958 10.1007/s11664-004-0022-0
- (2004) J. Electron. Mater. , vol.33 , pp. 958
- Liu, J.P.¹ Guo, F.² Yan, Y.F.³ Wang, W.B.⁴ Shi, Y.W.⁵

6
- 34548543074
- Understanding the influence of copper nanoparticles on thermal characteristics and microstructural development of a tin-silver solder
- DOI 10.1007/s11665-007-9092-5
- D.C. Lin T.S. Srivatsan G.X. Wang R. Kovacevic 2007 J. Mater. Eng. Perform. 16 647 10.1007/s11665-007-9092-5 (Pubitemid 47381272)
- (2007) Journal of Materials Engineering and Performance , vol.16 , Issue.5 , pp. 647-654
- Lin, D.C.¹ Srivatsan, T.S.² Wang, G.-X.³ Kovacevic, R.⁴

7
- 33845586481
- IEEE, 30 May- 2 June
- J.S. Lee, K.M. Chu, D.Y. Jeon, R. Patzelt, D. Manessis, and A. Ostmann, Proceedings of the 56th Electronic Components and Technology Conference, IEEE, pp. 244-249, 30 May- 2 June 2006.
- (2006) Proceedings of the 56th Electronic Components and Technology Conference , pp. 244-249
- Lee, J.S.¹ Chu, K.M.² Jeon, D.Y.³ Patzelt, R.⁴ Manessis, D.⁵ Ostmann, A.⁶

8
- 33644910140
- 10.1016/j.tsf.2005.09.057
- S.M.L. Nai J. Wei M. Gupta 2006 Thin Solid Films 504 401 10.1016/j.tsf.2005.09.057
- (2006) Thin Solid Films , vol.504 , pp. 401
- Nai, S.M.L.¹ Wei, J.² Gupta, M.³

9
- 68949132079
- on-line
- E.K. Choi, K.Y. Lee, and T.S. Oh, J. Phys. Chem. Solids (2009), on-line.
- (2009) J. Phys. Chem. Solids
- Choi, E.K.¹ Lee, K.Y.² Oh, T.S.³

10
- 28044453784
- 10.1007/s11664-005-0197-z
- A. Lee K.N. Subramanian 2005 J. Electron. Mater. 34 1399 10.1007/s11664-005-0197-z
- (2005) J. Electron. Mater. , vol.34 , pp. 1399
- Lee, A.¹ Subramanian, K.N.²

11
- 39749085140
- Creep properties of composite solders reinforced with nano- and microsized particles
- DOI 10.1007/s11664-007-0208-3
- Y. Shi J. Liu Y. Yan Z. Xia Y. Lei F. Guo X. Li 2008 J. Electron. Mater. 37 507 10.1007/s11664-007-0208-3 (Pubitemid 351311857)
- (2008) Journal of Electronic Materials , vol.37 , Issue.4 , pp. 507-514
- Shi, Y.¹ Liu, J.² Yan, Y.³ Xia, Z.⁴ Lei, Y.⁵ Guo, F.⁶ Li, X.⁷

12
- 68949106893
- W. Engelmaier 2008 Global SMT Pack. 8 44
- (2008) Global SMT Pack. , vol.8 , pp. 44
- Engelmaier, W.¹

13
- 0003974903
- Israel University Press Jerusalem
- J.E. Bird, A.J. Mukherjee and J.E. Dorn. (1969) Quantitative Relation Between Properties and Microstructure. Israel University Press, 255.
- (1969) Quantitative Relation between Properties and Microstructure , pp. 255
- Bird, J.E.¹ Mukherjee, A.J.² Dorn, J.E.³

14
- 51249173178
- 10.1007/BF02673342
- Z. Mei D. Grivas M.C. Shine J.W. Morris Jr. 1990 J. Electron. Mater. 19 1273 10.1007/BF02673342
- (1990) J. Electron. Mater. , vol.19 , pp. 1273
- Mei, Z.¹ Grivas, D.² Shine, M.C.³ Morris, Jr.J.W.⁴

15
- 0032785584
- 10.1007/s11664-999-0197-5
- H.L. Reynolds S.H. Kang J.W. Morris Jr. 1999 J. Electron. Mater. 28 69 10.1007/s11664-999-0197-5
- (1999) J. Electron. Mater. , vol.28 , pp. 69
- Reynolds, H.L.¹ Kang, S.H.² Morris, Jr.J.W.³

16
- 68949138072
- Ph.D. Thesis, Dalian University of Technology
- M.L. Huang (Ph.D. Thesis, Dalian University of Technology, 2001).
- (2001)
- Huang, M.L.¹

17
- 0027610707
- 10.1115/1.2909310
- Y.H. Pao S.J.E. Badgley R. Govila J. Browning 1993 J. Electron. Pack. Trans. ASME 115 147 10.1115/1.2909310
- (1993) J. Electron. Pack. Trans. ASME , vol.115 , pp. 147
- Pao, Y.H.¹ Badgley, S.J.E.² Govila, R.³ Browning, J.⁴

18
- 0004206712
- Elsevier Amsterdam
- J. Cadek, Creep in Metallic Materials, Amsterdam: Elsevier, 1988, p.50
- (1988) Creep in Metallic Materials , pp. 50
- Cadek, J.¹

19
- 0015617542
- 10.1007/BF02645593
- F.A. Mohamed K.L. Murty J.W. Morris 1973 Metall. Trans. 4 935 10.1007/BF02645593
- (1973) Metall. Trans. , vol.4 , pp. 935
- Mohamed, F.A.¹ Murty, K.L.² Morris, J.W.³

20
- 0029289262
- 10.1016/0921-5093(94)09654-6
- P. Adeva G. Caruana O.A. Ruano M. Torralba 1995 Mater. Sci. Eng. A 194 17 10.1016/0921-5093(94)09654-6
- (1995) Mater. Sci. Eng. A , vol.194 , pp. 17
- Adeva, P.¹ Caruana, G.² Ruano, O.A.³ Torralba, M.⁴

21
- 0033905429
- 10.1007/s11664-000-0150-0
- V.I. Igoshev J.I. Kleiman 2000 J. Electron. Mater. 29 244 10.1007/s11664-000-0150-0
- (2000) J. Electron. Mater. , vol.29 , pp. 244
- Igoshev, V.I.¹ Kleiman, J.I.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.