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Intermetallics

Volumn 25, Issue , 2012, Pages 86-94

Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering

(3) Yang, Ming a Li, Mingyu a,b Wang, Chunqing b

a SHENZHEN UNIVERSITY (China)

b HARBIN INSTITUTE OF TECHNOLOGY (China)

Author keywords

A. Intermetallics, miscellaneous; B. Texture; C. Crystal growth; C. Joining; D. Microstructure

Indexed keywords

COARSENING BEHAVIOR; CU SUBSTRATE; GROWTH BEHAVIOR; GROWTH ORIENTATIONS; INTERMETALLICS , MISCELLANEOUS; LIQUID SOLDERS; LIQUID STATE; MOLTEN SOLDERS; PURE SN; PURE TIN; REACTION UNDER; REFLOW CONDITIONS; SN-3.5AG; SOLDER MATRIX; VOLUME DIFFUSION;

CRYSTAL GROWTH; DIFFUSION; EUTECTICS; GRAIN BOUNDARIES; INTERFACE STATES; INTERMETALLICS; LIQUIDS; SILVER; SOLDERING; SOLDERING ALLOYS; TEXTURES; VISUALIZATION;

TIN;

EID: 84862815225 PISSN: 09669795 EISSN: None Source Type: Journal
DOI: 10.1016/j.intermet.2012.02.023 Document Type: Article

Times cited : (61)

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