Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder

Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 9, 2010, Pages 910-916

  Gao, Lili ^a   Xue, Songbai ^a   Zhang, Liang ^a   Xiao, Zhengxiang ^a   Dai, Wei ^a   Ji, Feng ^a   Ye, Huan ^a   Zeng, Guang ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

FRACTURE MORPHOLOGY; HETEROGENEOUS NUCLEATION; INTERMETALLIC COMPOUNDS; MICROSTRUCTURE AND PROPERTIES; SN DENDRITES; SOLDER JOINTS;

FRACTURE; INTERMETALLICS; MECHANICAL PROPERTIES; MICROSTRUCTURE; PRASEODYMIUM; SOLDERING ALLOYS;

TIN;

EID: 77955473726     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-0017-y     Document Type: Article

References (17)

1. ST Kao JG Duh 2004 Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying J. Electron. Mater. 33 12 1445 1451 10.1007/s11664-004-0085-y 1:CAS:528:DC%2BD2MXhsVGl 2004JEMat..33.1445K
2. CMT Law CML Wu DQ Yu L Wang JKL Lai 2006 Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys J. Electron. Mater. 35 1 89 93 10.1007/s11664-006-0189-7 1:CAS:528: DC%2BD28Xht1OmtbY%3D 2006JEMat..35...89L
3. KS Kim SH Huh K Suganuma 2003 Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints J. Alloys Compd. 352 1-2 226 236 10.1016/S0925-8388(02)01166-0 1:CAS:528:DC%2BD3sXitlert7g%3D
4. BY Wu HW Zhong YC Chan MO Alam 2006 Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density J. Mater. Sci. Mater. Electron. 17 11 943 950 10.1007/s10854-006-0048-6 1:CAS:528:DC%2BD28XhtVWlurjF (Pubitemid 44480286)
5. FJ Cheng F Gao H Nishikaw T Takemoto 2009 Interaction behavior between the additives and Sn in Sn-3.0Ag-0.5Cu-based solder alloys and the relevant joint solderability J. Alloys Compd. 472 1-2 530 534 10.1016/j.jallcom.2008.05. 017 1:CAS:528:DC%2BD1MXivVWjsrs%3D
6. CML Wu YW Wong 2007 Rare-earth additions to lead-free solders J. Mater. Sci. Mater. Electron. 18 1-3 77 91 1:CAS:528:DC%2BD28XhtlWntLrJ
7. CML Wu DQ Yu CML Law L Wang 2004 Properties of lead-free solder alloys with rare earth element additions Mater. Sci. Eng. R Rep. 44 1 1 10.1016/j.mser.2004.01.001
8. MA Dudek RS Sidhu N Chawla M Renavikar 2006 Microstructure and mechanical behavior of novel rare earth-containing Pb-free solders J. Electron. Mater. 35 12 2088 2097 10.1007/s11664-006-0318-3 1:CAS:528:DC%2BD2sXms1eltw%3D%3D 2006JEMat..35.2088D (Pubitemid 46140896)
9. L Zhang SB Xue LL Gao Y Chen SL Yu Z Sheng G Zeng 2009 Effect of trace amount addition of rare earth on properties and microstructure of Sn-Ag-Cu alloys J. Mater. Sci. Mater. Electron. 20 12 1193 1199 10.1007/s10854-008-9850-7 1:CAS:528:DC%2BD1MXht1GmtrnP
10. JX Wang SB Xue ZJ Han SL Yu Y Chen YP Shi H Wang 2009 Effect of rare earth Ce on microstructures, solderability of Sn-Ag-Cu and Sn-Cu-Ni solders as well as mechanical properties of soldered joints J. Alloys Compd. 467 1-2 219 226 10.1016/j.jallcom.2007.12.033 1:CAS:528:DC%2BD1cXhsVymtL3F
11. YC Zhou QL Pan YB He WJ Liang WB Li YC Li CG Lu 2007 Microstructures and properties of Sn-Ag-Cu lead-free solder alloys containing La Trans. Nonferr. Met. Soc. China. 17 2 1043 1048
12. YM Shi J Tian H Hao ZD Xia YP Lei F Guo 2008 Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder J. Alloys Compd. 453 1-2 180 184 10.1016/j.jallcom.2006.11.165 1:CAS:528: DC%2BD1cXjtV2rsbc%3D (Pubitemid 351337641)
13. H Hao J Tian YW Shi YP Lei ZD Xia 2007 Properties of Sn3.8Ag0.7Cu solder alloy with trace rare earth element Y additions J. Electron. Mater. 36 7 766 774 10.1007/s11664-007-0138-0 1:CAS:528:DC%2BD2sXpt12ku70%3D 2007JEMat..36..766H (Pubitemid 47167390)
14. L.L. Gao, S.B. Xue, L. Zhang, Z. Sheng, G. Zeng, F. Ji. Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder. J. Mater. Sci. Mater. Electron. doi: 10.1007/s10854-009-9970-8
15. DQ Yu J Zhao L Wang 2004 Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements J. Alloys Compd. 376 1-2 170 175 10.1016/j.jallcom.2004. 01.012 1:CAS:528:DC%2BD2cXlslygtrg%3D
16. B Li YW Shi YP Lei F Guo ZD Xia B Zong 2005 Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint J. Electron. Mater. 34 3 217 224 10.1007/s11664-005-0207-1 2005JEMat..34..217L
17. N.Y. Chen, Bond-parametric function and its applications[M] (Science Press, Peking, 1976), p. 15