IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate

Journal of Alloys and Compounds

Volumn 392, Issue 1-2, 2005, Pages 247-252

  Yoon, Jeong Won ^a   Kim, Sang Won ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Intermetallic compounds; Pb free solder; Shear test; Sn Ag Cu Solder

Indexed keywords

COPPER; EUTECTICS; GROWTH KINETICS; INTERFACES (MATERIALS); INTERMETALLICS; METALLIZING; MORPHOLOGY; SHEAR STRENGTH; SILVER; SOLDERED JOINTS; SOLIDIFICATION; THERMAL EFFECTS; TIN ALLOYS;

JOINT STRENGTH; PB-FREE SOLDER; SHEAR TESTS; SN-AG-CU SOLDER;

SOLDERING ALLOYS;

EID: 15544387649     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2004.09.045     Document Type: Article

References (13)

1. M. Abtew, and G. Selvaduray Mater. Sci. Eng. R. 27 2000 95
2. K. Zeng, and K.N. Tu Mater. Sci. Eng. R. 38 2002 55
3. C.E. Ho, R.Y. Tsai, Y.L. Lin, and C.R. Kao J. Electron. Mater. 31 2002 584
4. Y.D. Jeon, S. Nieland, A. Ostmann, H. Reichl, and K.W. Paik J. Electron. Mater. 32 2003 548
5. K.S. Kim, S.H. Huh, and K. Suganuma J. Alloys Comp. 352 2003 226
6. S.W. Kim, J.W. Yoon, and S.B. Jung J. Electron. Mater. 33 2004 1182
7. C.E. Ho, Y.L. Lin, and C.R. Kao Chem. Mater. 14 2002 949
8. J.W. Yoon, and S.B. Jung J. Mater. Sci. 39 2004 4211
9. http://www.nemi.org/projects/ese/if_assembly.html.
10. W.T. Chen, C.E. Ho, and C.R. Kao J. Mater. Res. 17 2002 263
11. J.W. Yoon, S.W. Kim, and S.B. Jung Mater. Trans. 45 2004 727
12. J.W. Yoon, C.B. Lee, and S.B. Jung J. Electron. Mater. 32 2003 1195
13. M. He, W.H. Lau, G. Qi, and Z. Chen Thin Solid Films 462-463 2004 376