Research advances in nano-composite solders

Microelectronics Reliability

Volumn 49, Issue 3, 2009, Pages 223-234

  Shen, J ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; ELECTRONICS PACKAGING; FABRICATION; NANOCOMPOSITES; PACKAGING MATERIALS; SOLDERING ALLOYS; THERMOMECHANICAL TREATMENT;

COMPOSITE SOLDERS; DRIVING FORCES; ELECTRONIC PACKAGING INDUSTRIES; ELECTRONIC PACKAGING MATERIALS; FABRICATION METHODS; HIGH TEMPERATURES; IN-SITU METHODS; MECHANICAL MIXING METHODS; NANO STRUCTURES; SOLDER JOINTS; THERMO-MECHANICAL FATIGUES;

WELDING;

EID: 60849092529     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.10.004     Document Type: Article

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