Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn-3.8Ag-0.7Cu lead-free solder and copper substrate

Intermetallics

Volumn 33, Issue , 2013, Pages 8-15

  Tay, S L ^a   Haseeb, A S M A ^a   Johan, Mohd Rafie ^a   Munroe, P R ^b   Quadir, M Z ^b  

^a UNIVERSITY OF MALAYA   (Malaysia)

^b UNIVERSITY OF NEW SOUTH WALES   (Australia)

Author keywords

A. Composites; A. Intermetallics; B. Diffusion; D. Phase interfaces; F. Electron microscopy, transmission

Indexed keywords

ALLOYING EFFECT; COPPER SUBSTRATES; F. ELECTRON MICROSCOPY , TRANSMISSION; INTERDIFFUSION COEFFICIENTS; INTERFACIAL INTERMETALLICS; LEAD FREE SOLDERS; MOLTEN SOLDERS; NI NANOPARTICLES; NI PARTICLES; SAC-SOLDERS; SN-3.8AG-0.7CU SOLDER; SPREADING RATE; TYPE STRUCTURES; WEIGHT PERCENTAGES; WETTING ANGLE;

ALLOYING; ALLOYING ELEMENTS; BLENDING; ELECTRON MICROSCOPY; INTERMETALLICS; MORPHOLOGY; NANOPARTICLES; NICKEL; PHASE INTERFACES; SILVER; SOLDERING ALLOYS;

TIN;

EID: 84870312033     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2012.09.016     Document Type: Article

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