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Volumn , Issue , 2012, Pages 1-498
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Lead-free Solders: Materials Reliability for Electronics
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Author keywords
[No Author keywords available]
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Indexed keywords
HEALTH RISKS;
RELIABILITY;
ALLOY DEVELOPMENT;
COMPLIANT LEADS;
ELECTRONIC INTERCONNECTS;
IMPACT LOADINGS;
LEAD-BASED SOLDERS;
MATERIALS RELIABILITIES;
NANOSCALE REINFORCEMENTS;
THERMO MECHANICAL FATIGUES (TMF);
LEAD-FREE SOLDERS;
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EID: 84865609225
PISSN: None
EISSN: None
Source Type: Book
DOI: 10.1002/9781119966203 Document Type: Book |
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Times cited : (42)
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References (0)
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