SCOPUS 정보 검색 플랫폼

Journal of Materials Science: Materials in Electronics

Volumn 22, Issue 3, 2011, Pages 315-322

Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes

(6) Han, Y D a,b Nai, S M L c Jing, H Y a,b Xu, L Y a,b Tan, C M c,d Wei, J c

a TIANJIN UNIVERSITY (China)

b TIANJIN KEY LABORATORY OF ADVANCED JOINING TECHNOLOGY (China)

c SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY (Singapore)

d NANYANG TECHNOLOGICAL UNIVERSITY (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDERS; DENSITY VALUE; MECHANICAL CHARACTERIZATIONS; SN-3.5AG; SNAGCU SOLDER; SOLDER ALLOYS; THERMAL AND MECHANICAL PROPERTIES; THERMAL STABILITY; THERMOMECHANICAL PROPERTIES; ULTIMATE TENSILE STRENGTH; WEIGHT PERCENTAGES; WETTING PROPERTY; YIELD STRENGTH;

CARBON NANOTUBES; COPPER ALLOYS; MECHANICAL PROPERTIES; METALLURGY; REINFORCED PLASTICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TENSILE STRENGTH; TIN ALLOYS;

TIN;

EID: 79751538675 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-010-0135-6 Document Type: Article

Times cited : (83)

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