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Volumn 59, Issue 7, 2011, Pages 2731-2741

Mechanical properties of Pb-free SnAg solder joints

Author keywords

Intermetallic compounds; Lead free solders; Plastic deformation; Soldering; Transmission electron microscopy (TEM)

Indexed keywords

BULK PROPERTIES; BULK SOLDER; DISLOCATION MECHANISMS; INTERDENDRITIC ZONES; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDERS; MAXIMUM STRENGTH; MICROSTRUCTURE CHARACTERIZATION; NEAR-EUTECTIC COMPOSITION; PB FREE SOLDERS; PB-FREE; SHEAR TESTS; SN-AG SOLDER; SNAGCU SOLDER; SOLDER ALLOYS; SOLIDIFIED STRUCTURES;

EID: 79952329090     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2011.01.012     Document Type: Article
Times cited : (127)

References (20)
  • 17
    • 0000907755 scopus 로고
    • G. Sachs Z VDI 73 1928 734
    • (1928) Z VDI , vol.73 , pp. 734
    • Sachs, G.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.