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Volumn 59, Issue 7, 2011, Pages 2731-2741
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Mechanical properties of Pb-free SnAg solder joints
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Author keywords
Intermetallic compounds; Lead free solders; Plastic deformation; Soldering; Transmission electron microscopy (TEM)
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Indexed keywords
BULK PROPERTIES;
BULK SOLDER;
DISLOCATION MECHANISMS;
INTERDENDRITIC ZONES;
INTERMETALLIC COMPOUNDS;
LEAD-FREE SOLDERS;
MAXIMUM STRENGTH;
MICROSTRUCTURE CHARACTERIZATION;
NEAR-EUTECTIC COMPOSITION;
PB FREE SOLDERS;
PB-FREE;
SHEAR TESTS;
SN-AG SOLDER;
SNAGCU SOLDER;
SOLDER ALLOYS;
SOLIDIFIED STRUCTURES;
DUCTILITY;
EUTECTICS;
INTERMETALLICS;
LEAD;
LEAD COMPOUNDS;
MECHANICAL PROPERTIES;
MECHANICAL STABILITY;
PLASTIC DEFORMATION;
SOLDERING;
TRANSMISSION ELECTRON MICROSCOPY;
SOLDERING ALLOYS;
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EID: 79952329090
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/j.actamat.2011.01.012 Document Type: Article |
Times cited : (127)
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References (20)
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