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Volumn 477, Issue 1-2, 2009, Pages 909-914
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Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn-Ag-Cu solder and a Cu layer
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Author keywords
Flux; Lead free solder; Nanoparticles; Wetting
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Indexed keywords
AG NANOPARTICLES;
CU LAYERS;
EUTECTIC SOLDERS;
LEAD-FREE SOLDER;
MICROSTRUCTURAL OBSERVATIONS;
MOLTEN SOLDERS;
SN-AG-CU SOLDERS;
SOLDER ALLOYS;
SOLDER REFLOWS;
SURFACE-ACTIVE AGENTS;
WETTABILITY CHARACTERISTICS;
WETTING TESTS;
ALLOYS;
BRAZING;
COPPER ALLOYS;
DOPING (ADDITIVES);
EUTECTICS;
FLUXES;
LEAD;
NANOPARTICLES;
SILVER ALLOYS;
SOLDERING ALLOYS;
TIN;
TIN ALLOYS;
WELDING;
WETTING;
ZIRCONIUM ALLOYS;
SILVER;
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EID: 67349138190
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2008.11.015 Document Type: Article |
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Times cited : (57)
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References (14)
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