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Volumn 478, Issue 1-2, 2009, Pages L1-
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Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth
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Author keywords
Diffusion; Intermetallics; Soldering
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Indexed keywords
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EID: 67349152353
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2008.11.027 Document Type: Letter |
Times cited : (105)
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References (18)
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