메뉴 건너뛰기




Volumn 478, Issue 1-2, 2009, Pages L1-

Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth

Author keywords

Diffusion; Intermetallics; Soldering

Indexed keywords


EID: 67349152353     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.11.027     Document Type: Letter
Times cited : (105)

References (18)
  • 18
    • 67349167181 scopus 로고    scopus 로고
    • Doctor Dissertation, Technical University of Eindhoven
    • A. Paul, Doctor Dissertation, Technical University of Eindhoven, 2004.
    • (2004)
    • Paul, A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.