Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints

Journal of Electronic Materials

Volumn 36, Issue 1, 2007, Pages 17-25

  Chen, Z ^a   He, M ^a   Kumar, A ^a   Qi, G J ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Electroless nickel; Intermetallic compound (IMC); Lead free solder; Tensile strength

Indexed keywords

AGING TEMPERATURE; AGING TREATMENT; ELECTROLESS NICKEL; LEAD FREE SOLDERS;

INTERMETALLICS; NICKEL; SURFACE CHEMISTRY; TENSILE STRENGTH; THERMAL AGING;

SOLDERED JOINTS;

EID: 33947538226     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0008-1     Document Type: Article

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