Intermetallic compound formation at Sn-3.0Ag-0.5Cu-1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions

Journal of Alloys and Compounds

Volumn 438, Issue 1-2, 2007, Pages 110-115

  Wang, Feng Jiang ^a   Yu, Zhi Shui ^a   Qi, Kai ^a  

^a SHANGHAI UNIVERSITY OF ENGINEERING SCIENCE   (China)

Author keywords

Aging; Diffusion; Intermetallic compounds; Kirkendall voids; Lead free solder

Indexed keywords

AGE HARDENING; DIFFUSION; INTERFACES (MATERIALS); INTERMETALLICS; SOLDERING ALLOYS;

AGING TEMPERATURE; GRANULAR TYPE MORPHOLOGY; KIRKENDALL VOIDS; LEAD FREE SOLDER;

TIN ALLOYS;

EID: 34247626932     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.08.012     Document Type: Article

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