Silver nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure on copper

Soldering and Surface Mount Technology

Volumn 23, Issue 3, 2011, Pages 150-160

  Bukat, K ^a   Koscielski M ^a   Sitek, J ^a   Jakubowska, M ^b,c   Mlozniak A ^c  

^a TELE AND RADIO RESEARCH INSTITUTE   (Poland)

^b WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^c ukasiewicz Research Network Institute of Microelectronics and Photonics   (Poland)

Author keywords

Alloys; Metallurgy; Microstructure of "nano" solder joints; Nanoparticle addition; Silver; Solder paste; Wetting

Indexed keywords

CHEMICAL COMPOSITIONS; CONTACT-ANGLE MEASUREMENTS; COPPER FOILS; COPPER SUBSTRATES; DESIGN/METHODOLOGY/APPROACH; DOUBLE SIDED; GRAIN SIZE; MICROSTRUCTURAL ANALYSIS; NANO POWDERS; NANOPARTICLE ADDITION; REFLOW--SOLDERING; RELIABILITY PROPERTIES; RESEARCH LIMITATIONS; SAC-SOLDERS; SCANNING ELECTRON MICROSCOPES; SILVER NANOPARTICLES; SN-AG-CU; SNAGCU SOLDER; SOLDER JOINTS; SOLDER PASTE; SOLDERING TEMPERATURE; STAR-LIKE; TEMPERATURE CONDITIONS; WETTING PROPERTY;

ANGLE MEASUREMENT; CERIUM ALLOYS; CONTACT ANGLE; COPPER; ENERGY DISPERSIVE SPECTROSCOPY; FLIP CHIP DEVICES; GRAIN SIZE AND SHAPE; INVESTMENTS; MECHANICAL PROPERTIES; METALLIC COMPOUNDS; MICROSTRUCTURE; NANOPARTICLES; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; TIN; TIN ALLOYS; WETTING;

SILVER;

EID: 79960739387     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911111146908     Document Type: Article

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