Microstructure characterization of SnAgCu solder bearing Ce for electronic packaging

Microelectronic Engineering

Volumn 88, Issue 9, 2011, Pages 2848-2851

  Zhang, Liang ^a,b   Xue, Song Bai ^a   Gao, Li Li ^a   Dai, Wei ^a   Ji, Feng ^a   Chen, Yan ^c   Yu, Sheng Lin ^a,d  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b JIANGSU NORMAL UNIVERSITY   (China)

^c HARBIN WELDING INSTITUTE   (China)

^d CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

Creep behavior; Creep rupture lives; Effect mechanism; Intermetallic compound; Lead free solder joints

Indexed keywords

CREEP BEHAVIORS; CREEP-RUPTURE LIVES; EFFECT MECHANISM; INTERMETALLIC COMPOUND; LEAD-FREE SOLDER JOINT;

CREEP; ELECTRONICS PACKAGING; INTERMETALLICS; RARE EARTHS; SILVER; SOLDERING ALLOYS;

TIN;

EID: 80051547371     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2011.05.021     Document Type: Article

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