Effects of rare earth Ce on microstructures, solderability of Sn-Ag-Cu and Sn-Cu-Ni solders as well as mechanical properties of soldered joints

Journal of Alloys and Compounds

Volumn 467, Issue 1-2, 2009, Pages 219-226

  Wang, Jian Xin ^a   Xue, Song Bai ^a   Han, Zong Jie ^a   Yu, Sheng Lin ^a,b   Chen, Yan ^c   Shi, Yi Ping ^a   Wang, Hui ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

^c HARBIN WELDING INSTITUTE   (China)

Author keywords

Mechanical property; Metals; Microstructure

Indexed keywords

ALLOYS; BRAZING; CERIUM; CERIUM COMPOUNDS; COPPER; COPPER ALLOYS; FRACTURE; MECHANICAL PROPERTIES; METAL REFINING; METALLIC COMPOUNDS; MICROSTRUCTURE; NICKEL; NICKEL ALLOYS; RARE EARTH ALLOYS; RARE EARTH ELEMENTS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS; WELDING;

BASE ALLOYS; CE ADDITIONS; CE CONTENTS; CU SUBSTRATES; FORCE TESTS; FRACTURE MORPHOLOGIES; GRAIN SIZES; SN-AG-CU; SOLDER ALLOYS; SOLDERABILITY; WETTING BALANCE METHODS;

TIN;

EID: 56849085502     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.12.033     Document Type: Article

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