Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads

Microelectronics Reliability

Volumn 50, Issue 12, 2010, Pages 2051-2058

  Fouzder, Tama ^a   Gain, Asit Kumar ^a   Chan, Y C ^a   Sharif, A ^b   Yung, Winco K C ^c  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b BANGLADESH UNIVERSITY OF ENGINEERING AND TECHNOLOGY   (Bangladesh)

^c HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

DIMPLED SURFACES; DUCTILE FAILURES; FINE MICROSTRUCTURE; FRACTURE SURFACES; HOMOGENEOUS DISTRIBUTION; INTERMETALLIC COMPOUND LAYER; MATRIX; NANO-AL; NANO-SIZED; RICH PHASE; SCALLOP-SHAPED; SECOND PHASE; SMOOTH SURFACE; SN-9ZN SOLDER; SN-ZN SOLDER; SOLDER JOINTS;

ALUMINUM; BRITTLE FRACTURE; COPPER; EUTECTICS; GOLD ALLOYS; HARDNESS; INTERMETALLICS; METALLIZING; MICROSTRUCTURE; NANOPARTICLES; SHEAR STRENGTH; SOLDERING ALLOYS; ZINC;

TIN;

EID: 78649442532     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.06.013     Document Type: Article

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