Effects of nano-structured particles on microstructure and microhardness of Sn-Ag solder alloy

Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 7, 2010, Pages 702-707

  Tai, F ^a   Guo, F ^a   Xia, Z D ^a   Lei, Y P ^a   Shi, Y W ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE GRAIN SIZE; AVERAGE SIZE; COMPOSITE SOLDERS; EUTECTIC SOLDERS; INTERMETALLIC COMPOUNDS; LEAD-FREE; MICROSTRUCTURE AND MECHANICAL PROPERTIES; NANO-STRUCTURED; POLYHEDRAL OLIGOMERIC SILSESQUIOXANES; SN-3.5AG; SN-AG SOLDER; SOLDER MATRIX; STRENGTHENING PHASE;

CERIUM ALLOYS; EUTECTICS; LEAD; MECHANICAL PROPERTIES; MICROHARDNESS; MICROSTRUCTURE; NANOSTRUCTURES; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 77955571731     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-9981-5     Document Type: Article

References (16)

1. K. N. Subramanian, A. Lee, S. Choi, P. Sonje, J. Electron. Mater. 30, 372 (2001)
2. F. W. Gayle, G. Becka, J. Badgett, G. Whitten, T. Y. Pan, A. Grusd, B. Bauer, R. Lathrop, J. Slattery, I. Anderson, J. Foley, A. Gickler, D. Napp, J. Mather, C. Olson, JOM 53, 17 (2001)
3. C. M. L. Wu, D. Q. Yu, C. M. T. Law, L. Wang, Mater. Sci. Eng. R 41, 1 (2004)
4. F. Tai, F. Guo, Z. D. Xia, Y. P. Lei, Y. F. Yan, J. P. Liu, Y. W. Shi, J. Electron. Mater. 34, 1357 (2005)
5. V. Sivasubramaniam, N. S. Bosco, J. Janczak-Rusch, J. Cugnoni, J. Botsis, J. Electron. Mater. 37, 1598 (2008)
6. J. S. Lee, K. M. Chu, R. Patzelt, D. Manessis, A. Ostmann, D. Y. Jeon, Microelectron. Eng. 85, 1577 (2008)
7. H. T. Lee, Y. H. Lee, Mater. Sci. Eng. A 419, 172 (2006)
8. F. Guo, J. Lee, S. Choi, J. P. Lucas, K. N. Subramanian, J. Electron. Mater. 30, 1073 (2001)
9. F. Guo, S. Choi, J. P. Lucas, K. N. Subramanian, Sold. Surf. Mount Technol. 13, 7 (2001)
10. F. Guo, J. Mater. Sci.-Mater. Electron. 18, 129 (2007)
11. A. Lee, K. N. Subramanian, J. Electron. Mater. 34, 1399 (2005)
12. F. Tai, F. Guo, B. Liu, H. Shen, Y. P. Lei, Y. W. Shi, Acta Mater. Compos. Sin. 25, 8 (2008)
13. Z. D. Xia, Z. G. Chen, Y. W. Shi, N. Mu, N. Sun, J. Electron. Mater. 31, 564 (2002)
14. P. Liu, P. Yao, J. Liu, J. Electron. Mater. 37, 874 (2008)
15. J. Shen, Y. C. Liu, D. J. Wang, H. X. Gao, J. Mater. Sci. Technol. 22, 529 (2006)
16. L. L. Zhang, W. K. Tao, J. H. Liu, Y. Zhang, Z. N. Cheng, C. Andersson, Y. L. Gao, Q. J. Zhai, in International Conference on Electronic Packaging-Technology & High Density Packaging, vol. 1(2008), p. 600