The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn-Ag lead free solder alloy

Journal of Alloys and Compounds

Volumn 542, Issue , 2012, Pages 136-141

  Niranjani, V L ^a   Chandra Rao, B S S ^b   Sarkar, Rajdeep ^a   Kamat, S V ^a  

^a DEFENCE METALLURGICAL RESEARCH LABORATORY   (India)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Creep; Lead free solder; Modified Garofalo's creep model; Nanoindentation

Indexed keywords

BASE ALLOYS; CONSTANT LOADS; CREEP BEHAVIORS; CREEP MODEL; EFFECT OF ADDITION; INDENTATION CREEP; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; NANO-SIZED; NANOINDENTERS; NICKEL PARTICLES; PRIMARY CREEP; SN-3.5AG; STEADY STATE CREEP RATE;

ALLOYS; CERIUM ALLOYS; CREEP; MOLYBDENUM; NANOINDENTATION; NICKEL; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 84865062993     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2012.07.044     Document Type: Article

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