Influence of minor POSS molecules additions on the microstructure and hardness of Sn3Ag0.5Cu-xPOSS composite solders

Journal of Materials Science: Materials in Electronics

Volumn 23, Issue 9, 2012, Pages 1640-1646

  Shen, Jun ^a   Peng, Changfei ^a   Yin, Heng Gang ^a   Chen, Jie ^a,b  

^a CHONGQING UNIVERSITY   (China)

^b Chongqing Instrument Material Research Institute   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDERS; MECHANICAL MIXTURES; MICROSTRUCTURAL OBSERVATIONS; NANOINDENTATION TESTS; POLYHEDRAL OLIGOMERIC SILSESQUIOXANES; SNAGCU SOLDER; SOLDER MATRIX;

EUTECTICS; HARDNESS; MICROSTRUCTURE; MOLECULES; OLIGOMERS; SILVER; SOLDERING ALLOYS;

TIN;

EID: 84864865114     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-012-0641-9     Document Type: Article

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