Microstructures and properties of SnZn lead-free solder joints bearing la for electronic packaging

IEEE Transactions on Electron Devices

Volumn 59, Issue 12, 2012, Pages 3269-3272

  Zhang, Liang ^a   Han, Ji Guang ^a   Guo, Yong Huan ^a   He, Cheng Wen ^a  

^a JIANGSU NORMAL UNIVERSITY   (China)

Author keywords

Mechanical properties; oxidation resistance; rare earth (RE); solder joints

Indexed keywords

ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; MICROSTRUCTURE; OXIDATION RESISTANCE; RARE EARTHS; WETTING;

ELECTRONIC PACKAGING; LEAD-FREE SOLDER JOINT; MICROSTRUCTURES AND PROPERTIES; SN-9ZN SOLDER; SN-ZN SOLDER; SOLDER JOINTS; TRACE AMOUNTS; UNIFORM MICROSTRUCTURE;

LANTHANUM;

EID: 84870295944     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2012.2219624     Document Type: Article

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