|
Volumn 123, Issue 2-3, 2010, Pages 629-633
|
Interfacial reactions between Sn-8Zn-3Bi-xNi lead-free solders and Cu substrate during isothermal aging
|
Author keywords
Aging; Interfacial reaction; Intermetallic compound; Lead free solder
|
Indexed keywords
AGING TIME;
AGING TREATMENT;
CU ATOMS;
CU SUBSTRATE;
DIFFUSION CONTROLLED;
GROWTH OF INTERMETALLICS;
IMC LAYER;
INTERFACIAL REACTIONS;
INTERMETALLIC COMPOUNDS;
ISOTHERMAL AGING;
LEAD FREE SOLDERS;
NI ADDITIONS;
REDUCTION EFFECTS;
SN-8ZN-3BI;
ZN ATOMS;
BISMUTH COMPOUNDS;
COPPER COMPOUNDS;
LEAD;
LEAD COMPOUNDS;
PHASE INTERFACES;
SEMICONDUCTING INTERMETALLICS;
SOLDERING;
SOLDERING ALLOYS;
ZINC;
TIN;
|
EID: 77955323384
PISSN: 02540584
EISSN: None
Source Type: Journal
DOI: 10.1016/j.matchemphys.2010.05.028 Document Type: Article |
Times cited : (17)
|
References (25)
|