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Volumn 123, Issue 2-3, 2010, Pages 629-633

Interfacial reactions between Sn-8Zn-3Bi-xNi lead-free solders and Cu substrate during isothermal aging

Author keywords

Aging; Interfacial reaction; Intermetallic compound; Lead free solder

Indexed keywords

AGING TIME; AGING TREATMENT; CU ATOMS; CU SUBSTRATE; DIFFUSION CONTROLLED; GROWTH OF INTERMETALLICS; IMC LAYER; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; ISOTHERMAL AGING; LEAD FREE SOLDERS; NI ADDITIONS; REDUCTION EFFECTS; SN-8ZN-3BI; ZN ATOMS;

EID: 77955323384     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2010.05.028     Document Type: Article
Times cited : (17)

References (25)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.