Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn-Ag-Cu solder joints during thermal cycling

Intermetallics

Volumn 31, Issue , 2012, Pages 72-78

  Han, Y D ^a,b   Jing, H Y ^a,b   Nai, S M L ^c   Xu, L Y ^a,b   Tan, C M ^c,d   Wei, J ^c  

^a TIANJIN UNIVERSITY   (China)

^b TIANJIN KEY LABORATORY OF ADVANCED JOINING TECHNOLOGY   (China)

^c SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^d NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

A. Composites; B. Thermal properties; D. Microstructure; F. Mechanical testing

Indexed keywords

COMPOSITE SOLDERS; CU SUBSTRATE; IMC THICKNESS; INTERFACIAL MICROSTRUCTURE; MONOLITHIC COUNTERPARTS; SHEAR TESTS; SN-AG-CU; SNAGCU SOLDER; SOLDER JOINTS; SOLDER MATRIX; THERMAL CYCLE; THERMOMECHANICAL PROPERTIES; ULTIMATE SHEAR STRENGTH; WEIGHT PERCENTAGES;

CARBON NANOTUBES; INTERMETALLICS; MECHANICAL TESTING; REINFORCED PLASTICS; SOLDERING; SOLDERING ALLOYS; THERMAL CYCLING;

TIN;

EID: 84866981504     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2012.06.002     Document Type: Article

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