Effects of Co nanoparticle addition to Sn-3.8Ag-0.7Cu solder on interfacial structure after reflow and ageing

Intermetallics

Volumn 19, Issue 5, 2011, Pages 707-712

  Haseeb, A S M A ^a   Leng, Tay See ^a  

^a UNIVERSITY OF MALAYA   (Malaysia)

Author keywords

A. Composites; A. Intermetallics; B. Diffusion; D. Phase interfaces; F. Scanning tunneling electron microscopy

Indexed keywords

A. COMPOSITES; A. INTERMETALLICS; B. DIFFUSION; D. PHASE INTERFACES; F. SCANNING TUNNELING ELECTRON MICROSCOPY;

COBALT; DISSOLUTION; INTERMETALLICS; NANOPARTICLES; SILVER; TIN;

PHASE INTERFACES;

EID: 79952280280     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2011.01.009     Document Type: Article

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