SCOPUS 정보 검색 플랫폼

Journal of Materials Science: Materials in Electronics

Volumn 22, Issue 8, 2011, Pages 1021-1027

Strengthening mechanism of nano-Al 2O 3 particles reinforced Sn3.5Ag0.5Cu lead-free solder

(5) Chuang, T H a Wu, M W b Chang, S Y c Ping, S F d Tsao, L C d

a NATIONAL TAIWAN UNIVERSITY (Taiwan)

b NATIONAL FORMOSA UNIVERSITY (Taiwan)

c NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

d NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE SIZE; COMPOSITE SOLDERS; GRAIN BOUNDARY REGIONS; LEAD FREE SOLDERS; LOWER DENSITY; MECHANICAL BEHAVIOR; NANO-AL; PARTICLES REINFORCED; SECOND PHASE PARTICLES; SN GRAINS; SOLDER MATRIX; STRENGTHENING MECHANISMS; THERMAL EXPANSION COEFFICIENTS; WEIGHT PERCENTAGES;

ALUMINUM; DIFFERENTIAL SCANNING CALORIMETRY; EUTECTICS; GRAIN BOUNDARIES; MECHANICAL PROPERTIES; PARTICLE REINFORCED COMPOSITES; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL EXPANSION; THERMOANALYSIS;

TIN;

EID: 80051546649 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-010-0253-1 Document Type: Article

Times cited : (66)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.