Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

Physical Review B - Condensed Matter and Materials Physics

Volumn 53, Issue 23, 1996, Pages 16027-16034

  Kim, H ^a   Tu, K ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000072496     PISSN: 10980121     EISSN: 1550235X     Source Type: Journal    
DOI: 10.1103/PhysRevB.53.16027     Document Type: Article

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