Creep behavior on Ag particle reinforced SnCu based composite solder joints

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 16, Issue 5, 2006, Pages 1116-1120

  Yan, Yan Fu ^a   Zhu, Jin Hong ^a   Chen, Fu Xiao ^a   He, Jun Guang ^a   Yang, Di Xin ^a  

^a HENAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Composite solder; Creep rupture life; Particle reinforcement; SnCu; Stress

Indexed keywords

COPPER ALLOYS; CREEP; MECHANICAL PROPERTIES; SCANNING ELECTRON MICROSCOPY; SILVER; SOLDERED JOINTS; STRESSES; TIN ALLOYS;

COMPOSITE SOLDER; CREEP RUPTURE LIFE; SNCU;

SOLDERING ALLOYS;

EID: 33846176947     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(06)60387-7     Document Type: Article

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