Tin-lead (SnPb) solder reaction in flip chip technology

Materials Science and Engineering: R: Reports

Volumn 34, Issue 1, 2001, Pages 1-58

  Tu, K N ^a   Zeng, K ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b AALTO UNIVERSITY   (Finland)

Author keywords

Flip chip technology; Intermetallic compound formation; Scallop type morphology; Solder reaction

Indexed keywords

AGING OF MATERIALS; COPPER; DIFFUSION IN SOLIDS; FLIP CHIP DEVICES; GOLD; INTERFACIAL ENERGY; INTERMETALLICS; METALLIC FILMS; METALLIZING; MORPHOLOGY; NICKEL; PALLADIUM; REACTION KINETICS; SOLDERING; THERMODYNAMICS; WETTING;

SCALLOP-TYPE MORPHOLOGY;

TIN ALLOYS;

EID: 0035797072     PISSN: 0927796X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0927-796X(01)00029-8     Document Type: Review

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