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Volumn 462, Issue 1-2, 2008, Pages 73-79
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Effects of multiple reflows on intermetallic morphology and shear strength of SnAgCu-xNi composite solder joints on electrolytic Ni/Au metallized substrate
a,c
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Author keywords
Composite materials; Intermetallics (IM); Microstructure; Thermal analysis
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Indexed keywords
BRAZING;
COPPER ALLOYS;
DIFFERENTIAL SCANNING CALORIMETRY;
ELECTROACUPUNCTURE;
INTERMETALLICS;
LEAD;
LITHOGRAPHY;
METALLIZING;
MICROFLUIDICS;
MORPHOLOGY;
NICKEL;
SCANNING;
SEMICONDUCTING INTERMETALLICS;
SHEAR STRENGTH;
SHEARING MACHINES;
SOLDERING ALLOYS;
STRENGTH OF MATERIALS;
TELLURIUM COMPOUNDS;
WELDING;
COMPOSITE SOLDERS;
CU(1 0 0) SUBSTRATES;
DIFFERENTIAL SCANNING CALORIMETER (DSC);
INTERFACE MICRO STRUCTURE;
INTERMETALLIC;
INTERMETALLIC COMPOUND (IMC);
LEAD-FREE SOLDER (SN-3.5AG-0.5CU);
MELTING BEHAVIORS;
MICROPARTICLES (MP);
NEEDLE LIKE;
SOLDER PASTES;
STRENGTH (IGC: D5/D6);
WETTING ABILITY;
METALS;
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EID: 45449105560
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2007.08.041 Document Type: Article |
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Times cited : (88)
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References (13)
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