Concurrent electromigration and creep in lead-free solder

Journal of Applied Physics

Volumn 110, Issue 8, 2011, Pages

  Pharr, Matt ^a   Zhao, Kejie ^a   Suo, Zhigang ^a   Ouyang, Fan Yi ^b,c   Liu, Pilin ^b  

^a HARVARD UNIVERSITY   (United States)

^b INTEL CORPORATION   (United States)

^c NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CURRENT FLOW; EXPERIMENTAL OBSERVATION; LEAD FREE SOLDERS; SOLDER BUMP; STRESS FIELD; THEORETICAL PREDICTION; THIN LAYERS;

CREEP; ELECTRIC CURRENT MEASUREMENT; SOLDERING; STRESSES;

ELECTROMIGRATION;

EID: 80655141665     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3656002     Document Type: Article

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