Development of SnAg-based lead free solders in electronics packaging

Microelectronics Reliability

Volumn 52, Issue 3, 2012, Pages 559-578

  Zhang, Liang ^a   He, Cheng Wen ^a   Guo, Yong Huan ^a   Han, Ji Guang ^a   Zhang, Yong Wei ^a   Wang, Xu Yan ^b  

^a JIANGSU NORMAL UNIVERSITY   (China)

^b CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION EFFECT; CREEP BEHAVIORS; CREEP-RUPTURE; ECONOMIC ADVANTAGES; ELECTRONIC ASSEMBLIES; ELECTRONICS DEVICES; HEALTH CONCERNS; HIGH RELIABILITY; HIGH-DENSITY; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; MATRIX; MICROSTRUCTURES AND PROPERTIES; ROOM TEMPERATURE; SN-AG SOLDER; SOLDER JOINTS;

ADSORPTION; ALLOYING; ALLOYING ELEMENTS; ALLOYS; CERIUM ALLOYS; CREEP; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; MICROSTRUCTURE; NANOPARTICLES; RARE EARTHS; REFINING; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS; ZIRCONIUM ALLOYS;

TIN;

EID: 84857359560     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.10.006     Document Type: Review

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