SCOPUS 정보 검색 플랫폼

Volumn 162, Issue 2, 2009, Pages 92-98

Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages

(3) Gain, Asit Kumar a Chan, Y C a Yung, Winco K C b

a CITY UNIVERSITY OF HONG KONG (Hong Kong)

b HONG KONG POLYTECHNIC UNIVERSITY (Hong Kong)

Author keywords

Ball grid array solder joints; Microstructure; Nano doping; Shearing force

Indexed keywords

BALL GRID ARRAYS; BINARY ALLOYS; DUCTILE FRACTURE; LEAD-FREE SOLDERS; LOADS (FORCES); NICKEL COMPOUNDS; SHEAR FLOW; SOLDERED JOINTS; TERNARY ALLOYS; TIN ALLOYS; ZINC ALLOYS;

BALL GRID ARRAY SOLDER JOINTS; FRACTURE SURFACES; INTERFACIAL MICROSTRUCTURE; NANO NI; NANO-DOPING; NI ADDITIONS; NI POWDER; REFLOW CYCLES; SHEAR LOADS; SHEARING FORCE;

MICROSTRUCTURE;

EID: 67649292799 PISSN: 09215107 EISSN: None Source Type: Journal
DOI: 10.1016/j.mseb.2009.03.010 Document Type: Article

Times cited : (63)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.