Properties of new nano-structured particles reinforced lead-free composite solders

Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica

Volumn 27, Issue 1, 2010, Pages 144-149

  Tai, Feng ^a   Guo, Fu ^a   Liu, Bin ^a   Shen, Hao ^a   Shi, Yaowu ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Composite solder; Creep rupture life; POSS; Shear strength; Spreadability property

Indexed keywords

COMPOSITE SOLDERS; CREEP RUPTURE LIFE; DIFFERENT MASS; LEAD-FREE; MECHANICAL PERFORMANCE; NANO-SIZED; NANO-STRUCTURED; POLYHEDRAL OLIGOMERIC SILSESQUIOXANES; REINFORCING PARTICLES; SN-3.0AG-0.5CU; SN-3.5AG; SN-AG-CU; SOLDER MATRIX; SPREADABILITY;

CREEP; LEAD; MECHANICAL PROPERTIES; PARTICLE REINFORCED COMPOSITES; REINFORCEMENT; SHEAR STRENGTH; SILVER; SOLDERING ALLOYS;

TIN;

EID: 77950897802     PISSN: 10003851     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (17)

1. Ning C L. A thorough look at leadfree solder alternatives [J]. Circuits Assembly, 1998, 9(4): 64-71.
2. Marshall J L, Calderon J, Sees J, Lucey G, Hwang J S. Composite solders [C]// IEEE Transactions on Components, Hybrids, and Manufacturing Technology. Atlanta: ECTC, 1991, 14(4): 698-702.
3. 2006: 86-99.
4. Tai F, Guo F, Xia Z D, Lei Y P, Yan Y F, Liu J P, Shi Y W. Processing and creep properties of SnCu composite solders with small amounts of nanosized Ag reinforcement additions [J]. Journal of Electronic Materials, 2005, 34(11): 1357-1362.
5. Guo F, Choi S, Lucas J P, Subramanian K N. Microstructural characterization of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5 Ag composite solders [J]. Soldering and Surface Mount Technology, 2001, 13(1): 7-18.
6. Guo F, Lee J, Choi S, Lucas J P, Subramanian K N. Processing and aging characteristics of eutectic Sn3.5Ag solder reinforced with mechanically incorporated Ni particles [J]. J Electr Mater, 2001, 30(9): 1073-1082.
7. Guo F, Lucas J P, Subramanian K N. Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints [J]. Journal of Materials Sciences: Materials in Electronics, 2001, 12(1): 27-35.
8. McDougall J, Choi S, Bieler T R, Subramanian K N, Lucas J P. Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joint [J]. Materials Science and Engineering A, 2000, 285(1/2): 25-34.
9. Li G Z, Wang L C, Ni H L. Pittman C U. Polyhedral oligomeric silsesquioxane (POSS) polymers and copolymers: A review [J]. Journal of Inorganic and Organometallic Polymers, 2001, 11(3): 123-154.
10. Lee A, Subramanian K N. Development of nano-composite lead-free electronic solders [J]. Journal of Electronic Materials, 2005, 34(11): 1399-1407.
11. 1990: 168-170.
12. Tai Feng, Guo Fu, Liu Bin, Shen Hao, Lei Yongping, Shi Yaowu. Microstructure evolution and mechanical properties of Sn-Ag based composite solder joints during isothermal aging [J]. Acta Materiae Compositae Sinica, 2008, 25(5): 8-13.
13. Shawn H P, Timothy S H, Sandra J T. Developments in nanoscience: Polyhedral oligomeric silsesquioxane (POSS)polymers [J]. Solid State and Material Science, 2004, 8(1): 21-29.
14. Miric A Z, Grusd A. Lead-free alloys [J]. Soldering & Surface Mount Technology, 1998, 10(1): 19-25.
15. Bowers M T, Anderson S, Baker E S. 3-dimensional structure characterization of cationized polyhedral oligomeric silsesquioxanes (POSS) with styryl and phenethyl capping agents [J]. Int J Mass Spectrom, 2003, 227(1): 205-216.
16. Rhee H, Subramanian K N, Lee A. Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn3.5Ag solder joints [J]. Materials in Electronics, 2005, 16(3): 169-176.
17. Lee A, Feher F J, Brem G F, Barber J D. Breakthrough polymer finishing technology: Manufacturing productivity and polymer performance enhancements [C]// Annual Technical ConferenceANTEC, Conference Proceedings. Nashwille: Society of Plastic Engineers, 2003: 2798-2803.