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Volumn 477, Issue 1-2, 2009, Pages 552-559
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Effects of ZrO2 nanoparticles on the mechanical properties of Sn-Zn solder joints on Au/Ni/Cu pads
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Author keywords
Ball grid array (BGA) solder joints; Multiple reflows; Shear strength; Sn Zn based solder; ZrO2 nanoparticles
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Indexed keywords
ADSORPTION EFFECTS;
BALL GRID ARRAY (BGA) SOLDER JOINTS;
IMC LAYERS;
MICROSTRUCTURAL OBSERVATIONS;
MULTIPLE REFLOWS;
SHEAR TESTS;
SN-ZN SOLDERS;
SN-ZN-BASED SOLDER;
SOLDER BALLS;
SOLDER JOINTS;
SOLDER MATRIXES;
ZN ATOMS;
ZRO2 NANOPARTICLES;
ADSORPTION;
ATOMS;
BALL GRID ARRAYS;
BRAZING;
ELECTRIC CURRENTS;
GRAIN BOUNDARIES;
MECHANICAL PROPERTIES;
NANOPARTICLES;
SHEAR STRENGTH;
SOLDERING ALLOYS;
SPHERES;
WELDING;
ZINC;
ZINC ALLOYS;
ZIRCONIUM ALLOYS;
TIN;
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EID: 67349268917
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2008.10.140 Document Type: Article |
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Times cited : (72)
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References (16)
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