Microstructure and tensile properties of Sn-9Zn-xAg lead-free solder alloys

Scripta Materialia

Volumn 48, Issue 8, 2003, Pages 1047-1051

  Song, J M ^a   Lan, G F ^a   Lui, T S ^a   Chen, L H ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Mechanical properties; Microstructure; Sn Zn Ag

Indexed keywords

CRYSTAL MICROSTRUCTURE; DUCTILITY; EUTECTICS; LEAD; MORPHOLOGY; RAPID SOLIDIFICATION; TENSILE PROPERTIES;

EUTECTIC ALLOYS;

SOLDERING ALLOYS;

EID: 0037437278     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(02)00647-4     Document Type: Article

References (10)

1. Yang W., Messler R.W. Jr. J. Electron Mater. 23:1994;765.
2. Mavoori H., Chin J., Vaynman S., Moran B., Keer L., Fine M.E. J. Electron Mater. 41:1997;1269.
3. McCormack M, Jin S, Kammlott GW. In: Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment, ISEE, May 1-3 1995, Orlando, FL, USA. p. 171-6.
4. Hua F, Glazer J. Design & reliability of solders and solder interconnections. In: TMS Annual Meeting, 1997. p. 65.
5. Vaynman S., Fine M.E. Scr. Mater. 41:1999;1269.
6. Takemoto T., Funaki T., Matsunawa A. Weld. Res. Abroad. 46:2000;20.
7. McCormack M., Jin S. J. Electron Mater. 23:1994;715.
8. Chuang C.M., Lui T.S., Chen L.H. J. Mater. Sci. 37:2002;191.
9. Chuang C.M., Lui T.S., Chen L.H. J. Mater. Res. 16:2001;2644.
10. Yin TM, Chuang CM, Lui TS, Chen LH, in preparation.