The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads

Journal of Alloys and Compounds

Volumn 506, Issue 1, 2010, Pages 216-223

  Gain, Asit Kumar ^a   Fouzder, Tama ^a   Chan, Y C ^a   Sharif, A ^b   Wong, N B ^a   Yung, Winco K C ^c  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b BANGLADESH UNIVERSITY OF ENGINEERING AND TECHNOLOGY   (Bangladesh)

^c HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Ball grid array solder joints; Microstructure; Nano doping; Shearing force

Indexed keywords

ADDITION OF AL; AGING TIME; BALL GRID ARRAY SOLDER JOINTS; BALL-SHEAR TEST; CU INTERMETALLICS; FINE MICROSTRUCTURE; INTERFACIAL MICROSTRUCTURE; INTERMETALLIC COMPOUND LAYER; INTERMETALLIC COMPOUNDS; LONG-TIME AGING; MULTIPLE REFLOW CYCLES; NANO-DOPING; REFLOW CYCLES; SCALLOP-SHAPED; SECOND PHASE; SHEARING FORCE; SN-AG-AL; SNAGCU SOLDER; SOLDER JOINTS; TOP SURFACE;

ALUMINUM; BALL GRID ARRAYS; EUTECTICS; GOLD ALLOYS; METALLIZING; MICROSTRUCTURE; NANOPARTICLES; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SHEARING; SHEARING MACHINES; SILVER; SILVER ALLOYS; SPHERES; TIN; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 77956094965     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.06.180     Document Type: Article

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