Wetting properties and interfacial microstructures of Sn-Zn-xGa solders on Cu substrate

Materials and Design

Volumn 31, Issue 4, 2010, Pages 2196-2200

  Chen, WenXue ^a   Xue, SongBai ^a   Wang, Hui ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CU SUBSTRATE; CU-SN COMPOUNDS; GA CONTENT; INTERFACIAL MICROSTRUCTURE; LEAD FREE SOLDERS; LIQUID SOLDERS; PROTECTIVE FILMS; WETTING PROPERTY; ZN ATOMS;

GALLIUM; GALLIUM ALLOYS; LEAD; MICROSTRUCTURE; PHASE INTERFACES; SOLDERING; SOLDERING ALLOYS; SURFACE TENSION; WETTING; ZINC;

TIN;

EID: 72749114030     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matdes.2009.10.053     Document Type: Article

References (18)

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