Microstructural development in a rapidly cooled eutectic Sn-3.5% Ag solder reinforced with copper powder

Powder Technology

Volumn 166, Issue 1, 2006, Pages 38-46

  Lin, D C ^a   Srivatsan, T S ^b   Wang, G X ^b   Kovacevic, R ^a  

^a SOUTHERN METHODIST UNIVERSITY   (United States)

^b University of Akron   (United States)

Author keywords

Cu6Sn5 intermetallic compound; Micro sized Cu powder; Microstructural development; Rapid cooling; Sn 3.5 Ag alloy

Indexed keywords

COOLING; COPPER POWDER; INTERMETALLICS; MICROSTRUCTURE; MIXING; SILVER; SOLDERING ALLOYS; SOLIDIFICATION; TIN;

CU6SN5 INTERMETALLIC COMPOUND; MICRO-SIZED CU POWDER; MICROSTRUCTURAL DEVELOPMENT; RAPID COOLING; SN-3.5% AG ALLOY;

EUTECTICS;

COPPER; SILVER; TIN;

COOLING; COPPER POWDER; EUTECTICS; INTERMETALLICS; MICROSTRUCTURE; MIXING; SILVER; SOLDERING ALLOYS; SOLIDIFICATION; TIN;

ARTICLE; CHEMICAL STRUCTURE; COMPOSITE MATERIAL; COOLING; DISSOLUTION; FLOW KINETICS; HEATING; MELTING POINT; PARTICULATE MATTER; POWDER; TEMPERATURE;

EID: 33746123442     PISSN: 00325910     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.powtec.2006.02.009     Document Type: Article

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