Metallurgical challenges in microelectronic 3D IC packaging technology for future consumer electronic products

Science China Technological Sciences

Volumn 56, Issue 7, 2013, Pages 1740-1748

  Tu, K N ^a,b   Tian, Tian ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

3D IC packaging; localized heating; microbump

Indexed keywords

BINARY ALLOYS; COPPER; METALLURGY; MICROELECTRONICS; SOLDERED JOINTS; TIMING CIRCUITS; TIN ALLOYS;

CONTROLLED GROWTH; IC PACKAGING; KIRKENDALL VOID; LOCALIZED HEATING; MICRO-BUMPS; MICROSTRUCTURAL STABILITY; MULTI-LAYERED; MULTIPLE REFLOWS;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84879886361     PISSN: 16747321     EISSN: 18691900     Source Type: Journal    
DOI: 10.1007/s11431-013-5261-y     Document Type: Article

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