Interfacial reactions between lead-free solders and common base materials

Materials Science and Engineering R: Reports

Volumn 49, Issue 1-2, 2005, Pages 1-60

  Laurila, T ^a   Vuorinen, V ^a   Kivilahti, J K ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

Diffusion kinetics; Intermetallic compounds; Lead free solders; Metallization; Microstructures; Thermodynamics

Indexed keywords

GROWTH (MATERIALS); INTERFACES (MATERIALS); INTERMETALLICS; METALLIZING; MICROSTRUCTURE; REACTION KINETICS; SURFACE CHEMISTRY; THERMODYNAMICS;

DIFFUSION KINETICS; INTERCONNECTION METALLURGY; INTERFACIAL REACTIONS; LEAD-FREE SOLDERS;

SOLDERING ALLOYS;

EID: 20344388336     PISSN: 0927796X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mser.2005.03.001     Document Type: Review

References (128)

1. P. Viswanadham, S. Dunford, and J.K. Kivilahti Reliability aspects of lead-free solders in electronic assemblies K. Puttlitz K. Stalter Handbook of Lead-Free Solder Technology for Microelectronic Assemblies 2004 Marcel Dekker New York
2. P. Vianco, and D. Frear JOM 14 1993
3. D. Frear, J. Jang, J. Lin, and C. Zhang JOM 53 6 2001 28
4. K. Erickson, P. Hopkins, and P. Vianco J. Electr. Mater. 27 11 1998 1177
5. P. Vianco, A. Kilgo, and R. Grant J. Electr. Mater. 24 10 1995 1493
6. M. Shaefer, W. Laub, R. Fournelle, and J. Liang Design and reliability of solders and solder interconnections R.K. Mahidhara D.R. Frear S.M. Sastry K. Murty P. Liaw W. Winterbottom The Minerals, Metals and Materials Society 1997 TMS/AIME Warredale, USA
7. J.K. Kivilahti, and K. Kulojärvi R.K. Mahidhara Proceedings of the TMS Annual Meeting on Design and Reliability of Solders and Solder Interconnections Orlando, FL, USA, February 9-13 1997 377 384
8. J.K. Kivilahti JOM 54 12 2002 52 57
9. P. Vianco, P. Hopkins, K. Erickson, D.R. Frear, and R. Davidson Design and reliability of solders and solder interconnections R.K. Mahidhara D.R. Frear S.M. Sastry K. Murty P. Liaw W. Winterbottom The Minerals, Metals and Materials Society 1997 TMS/AIME Warredale, USA
10. P. Marjamäki, T. Mattila, and J.K. Kivilahti Proceedings of the 2005 IEEE/EIA CPMT Electronic Component and Technology Conference (ECTC'05) Orlando, FL, USA, May 31-June 3 2005
11. T. Mattila, V. Vuorinen, and J.K. Kivilahti J. Mater. Res. 19 11 2004 3214
12. T. Mattila, J.K. Kivilahti, J. Electr. Mater., in press.
13. F.J.J. van Loo Prog. Solid St. Chem. 20 1990 47
14. C.T. Heycock, and F.H. Neville Phil. Trans. R. Soc. London Ser. A 202 1904 1
15. T. Ishara J. Inst. Met. 31 1924 315
16. M. Hamasumi J. Inst. Met. 53 1933 550
17. G.V. Raynor Annoted Equilibrium Diagram Series, No. 2 1944 The Institute of Metals London
18. J. Bernal Nature 122 3063 1928 54
19. A. Gangulee, C. Das, and M. Bever Metall. Trans. 4 1973 2063
20. A-K. Larsson, L. Stenberg, and S. Lidin Acta Cryst. B 50 1994 636
21. T. Laurila, V. Vuorinen, T. Mattila, J.K. Kivilahti, Unpublished results.
22. J. Koivisto, M.Sc. Thesis, Helsinki University of Technology, 2003.
23. C. Kao Mater. Sci. Eng. A 238 1997 196
24. IPMA, The Thermodynamic Databank for Interconnection and Packaging Materials 2000 Helsinki University of Technology Helsinki
25. W. Bader Welding J. 48 12 1969 551
26. W. Bader Proceedings of the Conference on Physical Metallurgy, Metal Joining St. Louis, MO, October 16-17 1980 TMS/AIME Warredale, USA
27. R. Gagliano, G. Ghosh, and M. Fine J. Electr. Mater. 31 11 2002 1195
28. H. Fidos, and H. Schreiner Z. Metallkde. 61 1971 225
29. T. Mattila, J.K. Kivilahti, Unpublished results.
30. T. Chiu, K. Zeng, R. Stierman, D. Edwards, and K. Ano Proceedings of the Electronics Components and Technology Conference 2004
31. H. Yu, J.K. Kivilahti, in press.
32. A. Hayashi, C. Kao, and Y. Chang Scripta Mater. 37 4 1997 393
33. P. Vianco, P. Hlava, and A. Kilgo J. Electr. Mater. 23 7 1994 583
34. S. Kim, and K. Ba Proceedings of the Third Electronics Packaging Technology Conference (EPTC 2000) December 5-7 2000 81
35. K.N. Tu Acta Metall. 21 1973 347
36. K.N. Tu, and R. Thompson Acta Metall. 30 1982 947
37. K.N. Tu Mater. Chem. Phys. 46 1996 217
38. M. Oh, Doctoral Dissertation, Lehigh University, 1994.
39. J. Philibert Atom Movements, Diffusion and Mass Transport in Solids 1991 Les Editions de Physique France
40. H. Bhedwar, K. Ray, S. Kulkarni, and V. Balasubramanian Scripta Metall. 6 1972 919
41. L. Revay Surf. Technol. 5 1977 57
42. M. Onishi, and H. Fujibuchi Trans. Jpn. Inst. Met. 16 1975 539
43. Z. Mei, A. Sunwoo, and J. Morris Metall. Trans. 23A 1992 857
44. C. Wagner Acta Metall. 17 1969 99
45. K. Rönkä, F.J.J. van Loo, and J.K. Kivilahti Metall. Mater. Trans. 29A 1998 2951
46. K. Zeng, R. Stierman, T.-C. Chiu, D. Edwards, K. Ano, and K.N. Tu J. Appl. Phys. 97 2005
47. A. Paul, Doctoral Dissertation, Technical University of Eindhoven, 2004.
48. M.J.H. van Dal, A.M. Gusak, C. Cserhati, A.A. Kodentsov, and F.J.J. van Loo Phys. Rev. Lett. 86 2001 3352
49. M.J.H. van Dal, A.M. Gusak, C. Cserhati, A.A. Kodentsov, and F.J.J. van Loo Phil. Mag. A 82 2002 943
50. T. Takemoto, and T. Yamamoto J. JCBRA 40 1 2001 309
51. X. Ma, Y. Qian, and F. Yoshida J. Alloys Comp. 334 2002 224
52. E. Ohriner Welding J. 191 1987
53. I. Belova, and G.E. Murch Phil. Mag. A 80 9 2000 2073
54. I. Belova, and G.E. Murch Phil. Mag. A 82 2 2002 269
55. V. Vuorinen, T. Laurila, J.K. Kivilahti, Unpublished results.
56. H. Sato, and R. Toth T. Massalski Alloying Behaviour and Effects in Concentrated Solid Solutions 1965 Gordon & Breach New York 295
57. G. Ghosh J. Mater. Res. 19 5 2004 1439
58. J.K. Kivilahti IEEE Trans. Compon. Pack Manuf. Technol. B 18 2 1995 326
59. V.C. Marcotte, and K. Schroeder MRS Symp. Proc. 19 1983 403
60. P. Oberndorff, Doctoral Dissertation, Technical University of Eindhoven, 2001.
61. K. Rönkä, F.J.J. van Loo, and J.K. Kivilahti Scripta Mater. 37 10 1997 1575
62. P. Liu, and J. Shang Scripta Mater. 44 2001 1019
63. B.J. Keene Int. Mater. Rev. 38 4 1993 157
64. P. Nash, and A. Nash Bull. Alloy Phase Diag. 6 1985 350
65. T. Massalski Binary Alloy Phase Diagrams 1996 ASM
66. S. Bader, W. Gust, and H. Hieber Acta Metall. Mater. 43 1 1995 329
67. D. Gur, and M. Bamberger Acta Mater. 46 14 1998 4917
68. W. Choi, and H. Lee Scripta Mater. 46 2002 777
69. D. Turnbull J. Appl. Phys. 21 1950 1022
70. J. Haimovich Welding J. 68 3 1989 102
71. V. Vuorinen, T.M. Korhonen, J.K. Kivilahti, Internal Report, HUT-EPT-4, Helsinki University of Technology, 2001, ISBN 951-22-5629-0.
72. C.-H. Lin, S.-W. Chen, and C.-H. Wang J. Electr. Mater. 31 2002 907
73. W.T. Chen, C.E. Ho, and C.R. Kao J. Mater. Res. 17 2002 263
74. C.E. Ho, R.Y. Tsai, Y.L. Lin, and C.R. Kao J. Electr. Mater. 31 2002 584
75. P.-L. Wu, M.-K. Huang, C. Lee, and S.-R. Tzan J. Electr. Mater. 33 2004 161
76. J.Y. Tsai, Y.C. Hu, C.M. Tsai, and C.R. Kao J. Electr. Mater. 32 2003 1203
77. K. Zeng, V. Vuorinen, and J.K. Kivilahti IEEE Trans. Compon. Packaging Manuf. Technol. 25 2002 162
78. S.C. Hsu, S.J. Wang, and C.Y. Liu J. Electr. Mater. 32 2003 1214
79. S.J. Wang, and C.Y. Liu J. Electr. Mater. 32 2003 1303
80. K. Zeng, and K.N. Tu Mater. Sci. Eng. R 38 2002 64
81. S.K. Kang, and V. Ramachandran Scripta Metall. 14 1980 421
82. W.J. Thomlinson, and H.G. Rhodes J. Mater. Sci. 22 1987 1769
83. C.Y. Lee, and K.L. Lin Thin Solid Films 249 1994 201
84. K.L. Lin, and J.T. Chang Scripta Metall. 30 1994 559
85. J.W. Jang, P.G. Kim, K.N. Tu, D.R. Frear, and P. Thomson J. Appl. Phys. 85 1999 8456
86. P. Liu, Z. Xu, and J. Shang Metall. Mater. Trans. 31A 2000 2857
87. V. Vuorinen, T. Laurila, T. Mattila, J.K. Kivilahti, in press.
88. H. Matsuki, H. Ibuka, and H. Saka Sci. Tech. Adv. Mater. 3 2002 261
89. J. Lee, F. Guo, K.N. Subramanian, and J.P. Lucas Sold. Surf. Mount. Technol. 14 2 2002 11
90. L.C. Shiau, C. Ho, and C.R. Kao Sold. Surf. Mount. Technol. 14 3 2002 25
91. M. Bhargava, and K. Schubert J. Less-Common Met. 33 1973 181
92. C.W. Hwang, K. Suganuma, M. Kiso, and S. Hashimoto J. Mater. Res. 18 11 2003 2540
93. J.W. Yoon, C.B. Lee, and S.B. Jung J. Electr. Mater. 32 11 2003 1195
94. F. Foster ASTM Spec. Publ. 319 1963 13
95. W. Harding, and H. Pressly Proceedings of the 50th Annual American Electroplating Society 1963 90
96. W. Mulholland, and D. Willyard Welding J. Res. Suppl. 54 10 1974 466
97. A. Romig, Y. Chang, J. Stephens, D. Frear, V. Marcotte, C. Lea, in: D. Frear, W. Jones, K. Kinsman (Eds.), EMPMD Monograph series, vol. 1: Solder Mechanics - A State of the Art Assessment, TMS, Santa Fe, NM, 1994, p. 29.
98. P. Kim, and K.N. Tu J. Appl. Phys. 80 7 1996 3822
99. P. Kim, and K.N. Tu Mater. Chem. Phys. 53 2 1998 165
100. J. Marshall, K. Zeng, T. Laurila, Private discussion via e-mail, 1999.
101. M. Robertson, M. Karnowsky, SC-TM-68-728, Sandia National Laboratories, Albuquerque, NM, December 1968.
102. S. Nakahara, and R. McCoy Appl. Phys. Lett. 37 1 1980 42
103. C. Chang, T. Callcott, and E. Arakawa J. Appl. Phys. 53 11 1982 7362
104. L. Buene Thin Solid Films 47 1977 159
105. L. Buene, and S. Jacobson Phys. Scripta 18 1978 397
106. L. Buene, H. Falkenberg-Arell, J. Gjonnes, and J. Tafto Thin Solid Films 67 1980 95
107. B. Hugsted, L. Buene, T. Finstand, O. Lonsjo, and T. Olsen Thin Solid Films 98 1982 81
108. S. Nakahara, R. McCoy, L. Buene, and J. Vandenberg Thin Solid Films 84 1981 185
109. V. Simic, and Z. Marinkovic J. Less-Common Met. 51 1977 177
110. B. Dyson J. Appl. Phys. 37 6 1966 482
111. M. Creydt, and R. Fichter Metallurgy (Berlin) 25 1971 1124
112. C. Herzig, and T. Heumann Z. Naturforsch. Teil A 27 1972 1109
113. Z. Mei, A. Eslambochi, and P. Johnsson Proceedings of the 48th Electronic Components and Technology Conference 1998 IEEE Piscataway, NJ 952
114. A. Minor, and J. Morris Metall. Mater. Trans. 31A 2000 798
115. S. Anhock, H. Oppermann, C. Kallmayer, R. Aschenbrenner, L. Thoman, and H. Reichel Proceedings of the 22nd IEEE/CPMT International Electronics Manufacturing Technology Symposium Berlin, Germany 1998 IEEE New York 156
116. L. Zavalij, A. Zribi, R. Chromik, S. Pitely, P. Zavalij, and E. Cotts J. Alloys Comp. 334 2002 79
117. C. Ho, L. Shiau, and C. Kao J. Electr. Mater. 31 11 2002 1264
118. L. Shiau, C. Ho, and C. Kao Sold. Surf. Mount. Technol. 14 3 2002 25
119. T. Laurila, V. Vuorinen, T. Mattila, and J.K. Kivilahti J. Electr. Mater. 34 1 2005 103
120. J. Roeder, Doctoral Dissertation, Lehigh University, 1988.
121. C. Thwaites Trans. Inst. Met. Finishing 43 1965 143
122. A. Brunson, and M. Gerl Phys. Rev. 21B 12 1980 5447
123. S. Sen, A. Ghorai, and K. Bandyopadhyay Thin Solid Films 155 1987 243
124. Z. Marinkovic, and V. Simic Thin Solid Films 195 1991 127
125. P. Gas, and J. Bernardini Scripta Metall. 12 1978 367
126. Th. Hehenkamp, and F. Faupel Acta Metall. 31 5 1983 691
127. U. Köhler, P. Neuhaus, and C. Herzig Z. Metallkde. 76 3 1985 171
128. A. Rolland, and D. Roux Scripta Metall. Mater. 24 1990 2253