Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy

Microelectronics Reliability

Volumn 50, Issue 8, 2010, Pages 1134-1141

  Ahmed, Mansur ^a   Fouzder, Tama ^b   Sharif, A ^a   Gain, Asit Kumar ^b   Chan, Y C ^b  

^a BANGLADESH UNIVERSITY OF ENGINEERING AND TECHNOLOGY   (Bangladesh)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

AG ADDITIONS; AG PARTICLES; ALLOY MELT; BINARY EUTECTICS; COMPOSITE SOLDERS; EUTECTIC SOLDERS; HOMOGENEOUS DISTRIBUTION; INTERMETALLIC COMPOUNDS; MATRIX; MICRO-PARTICLES; MICRO-STRUCTURAL; PARTICLE ADDITION; PARTICULATE REINFORCEMENTS; REINFORCING PARTICLES; SN-9ZN SOLDER; SN-ZN SOLDER; THERMAL BEHAVIORS;

CERIUM ALLOYS; EUTECTICS; INTERMETALLICS; MECHANICAL PROPERTIES; MICROSTRUCTURE; REINFORCEMENT; SILVER ALLOYS; SOLDERING ALLOYS; TENSILE STRENGTH; TIN; TIN ALLOYS; ZINC;

SILVER;

EID: 77955413319     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.03.017     Document Type: Article

References (30)

1. Y.S. Lai, H.M. Tong, and K.N. Tu Recent research advances in Pb-free solders Microelectron Reliab 49 2009 221 222
2. B.H.L. Chao, X. Zhang, S.H. Chae, and P.S. Ho Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints Microelectron Reliab 49 2009 253 263
3. J. Shen, and Y.C. Chan Research advances in nano-composite solders Microelectron Reliab 49 2009 223 234
4. Y.W. Wang, Y.W. Lin, and C.R. Kao Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates Microelectron Reliab 49 2009 248 252
5. W. Peng An investigation of Sn pest in pure Sn and Sn-based solders Microelectron Reliab 49 2009 86 91
6. A. Sharif, and Y.C. Chan Liquid, solid state interfacial reactions of Sn-Ag-Cu and Sn-In-Ag-Cu solders with Ni-P under bump metallization Thin Solid Films 504 2006 431 435
7. K.L. Lin, and Y.C. Wang Wetting interaction of Pb-free Sn-Zn-Al solders on metal plated substrate J Electron Mater 27 1998 1205 1210
8. V. Chidambaram, J. Hald, and J. Hattel Development of gold based solder candidates for flip chip assembly Microelectron Reliab 49 2009 323 330
9. M. McCormack, and S. Jin New, lead-free solders J Electron Mater 23 1994 635 640
10. G. Ghosh Interfacial reaction between multicomponent lead-free solders, Ag, Cu, Ni, and Pd substrates J Electron Mater 33 2004 1080 1091
11. A. Sharif, and Y.C. Chan Effect of substrate metallization on interfacial reactions and reliability of Sn-Zn-Bi solder joints Microelectron Eng 84 2007 328 335
12. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K.N. Tu Ductile-to-brittle transition in Sn-Zn solder joints measured by impact test Scr Mater 51 2004 641 645
13. F. Guo, J. Lee, S. Choi, J.P. Lucas, T.R. Bieler, and K.N. Subramanian Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles J Electron Mater 30 2001 1073 1082
14. D.C. Lin, G.X. Wang, T.S. Srivatsan, M. Al-Hajri, and M. Petraroli Influence of titanium dioxide nanopowder addition on microstructural development, hardness of tin-lead solder Mater Lett 57 2003 3193 3198
15. H. Mavoori, and S. Jin New, creep-resistant, low melting points with ultrafine oxide dispersions J Electron Mater 27 1998 1216 1222
16. K.K. Mohan, V. Kripesh, and A.A.O. Tay Influence of single-wall carbon nanotube addition on the microstructural, tensile properties of Sn-Pb solder alloy J Alloys Compd 455 2008 148 158
17. 2 nanoparticles on the microstructure and microhardness of Sn-3.5Ag lead-free solder Mater Sci Eng A 44 2006 135 141 (Pubitemid 44689063)
18. J.W. Yoon, and S.B. Jung Solder joint reliability evaluation of Sn-Zn/Au/Ni/Cu ball-grid-array package during aging Mater Sci Eng A 452-453 2007 46 54
19. J. Jiang, J.E. Lee, K.S. Kim, and K. Suganuma Oxidation behavior of Sn-Zn solders under high-temperature and high-humidity conditions J Alloys Compd 462 2008 244 251
20. W.D. Callister Materials science and engineering an introduction 4th ed. 1996 John Wiley & Sons Inc. Canada
21. G.E. Dieter Mechanical metallurgy 1986 McGraw-Hill Book Co. New York
22. C.C. Jao, Y.W. Yen, C.Y. Lin, and C. Lee Phase equilibria of the Sn-Zn-Ag system and interfacial reactions in Sn-Zn/Ag couples Intermetallics 16 2008 463 469
23. J.E. Lee, K.S. Kim, M. Inoue, J. Jiang, and K. Suganuma Effects of Ag, Cu addition on microstructural properties, oxidation resistance of Sn-Zn eutectic alloy J Alloys Compd 454 2008 310 320
24. J.M. Song, T.S. Lui, G.F. Lan, and L.H. Chen Resonant vibration behavior of Sn-Zn-Ag solder alloys J Alloys Compd 379 2004 233 239
25. K.I. Chen, S.C. Cheng, S. Wu, and K.L. Lin Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy J Alloys Compd 416 2006 98 105
26. G. Saad, A. Fawzy, and E. Shawky Effect of Ag addition on the creep characteristics of Sn-8.8 wt.% Zn solder alloy J Alloys Compd 479 2009 844 850
27. A.K. Gain, Y.C. Chan, A. Sharif, N.B. Wong, and W.K.C. Yung Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages Microelectron Reliab 49 2009 746 753
28. S.K. Das, A. Sharif, Y.C. Chan, N.B. Wong, and W.K.C. Yung Effect of Ag micro particles content on the mechanical strength of the interface formed between Sn-Zn binary solder and Au/Ni/Cu bond pads Microelectron Eng 86 2009 2086 2093
29. Z. Moser, J. Dutkiewicz, W. Gasior, and J. Salava The Sn-Zn (tin-zinc) system Bull Alloy Phase Diagrams 6 1985 330
30. K.L. Lin, and C.L. Shih Wetting interaction between Sn-Zn-Ag solders and Cu J Electron Mater 32 2003 95 100