Microstructure, kinetic analysis and hardness of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solder on OSP-Cu pads

Journal of Alloys and Compounds

Volumn 509, Issue 7, 2011, Pages 3319-3325

  Gain, Asit Kumar ^a   Fouzder, Tama ^a   Chan, Y C ^a   Yung, Winco K C ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Hardness; Kinetics analysis; Microstructure; Nano doping

Indexed keywords

COMPOSITE SOLDERS; FINE MICROSTRUCTURE; HARDNESS VALUES; IMC LAYER; INTERFACIAL MORPHOLOGIES; INTERMETALLIC COMPOUNDS; KINETIC ANALYSIS; KINETICS ANALYSIS; MATRIX; NANO-DOPING; NANO-SIZED; NANO-ZRO; ORGANIC SOLDERABILITY PRESERVATIVE; REACTION TIME; SN-AG-CU; SNAGCU SOLDER; SOLDER BALLS; SOLDER JOINTS; UNIFORM DISTRIBUTION;

ACTIVATION ANALYSIS; ACTIVATION ENERGY; HARDNESS; INTERMETALLICS; MICROSTRUCTURE; NANOPARTICLES; PARTICLE REINFORCED COMPOSITES; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS; ZIRCONIUM ALLOYS;

TIN;

EID: 78751613493     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.12.048     Document Type: Article

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