Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites

Thin Solid Films

Volumn 504, Issue 1-2, 2006, Pages 401-404

  Nai, S M L ^a   Wei, J ^b   Gupta, M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Composite; Lead free solder; Wettability and mechanical properties

Indexed keywords

CERAMIC MATERIALS; COMPACTION; COMPOSITE MATERIALS; EXTRUSION; SINTERING; SOLDERING ALLOYS;

COMPOSITE SOLDERS; LEAD-FREE SOLDERS; THRESHOLD ADDITION; WETTABILITY AND MECHANICAL PROPERTIES;

REINFORCEMENT;

EID: 33644910140     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.057     Document Type: Conference Paper

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