Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 25, Issue 3, 2002, Pages 162-167

  Zeng, Kejun ^a   Vuorinen, Vesa ^a   Kivilahti, Jorma K ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

Interface; Interfacial reaction; Intermetallics; Lead free soldering; Ni(P)Au; Solder joint reliability; Surface finish

Indexed keywords

INTERFACES (MATERIALS); INTERMETALLICS; MICROSTRUCTURE; NICKEL ALLOYS; PRINTED CIRCUIT BOARDS; RELIABILITY; SCANNING ELECTRON MICROSCOPY; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

LEAD-FREE SOLDER; SOLDER JOINT RELIABILITY; SURFACE FINISH;

SOLDERING ALLOYS;

EID: 0036665776     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2002.801648     Document Type: Article

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