Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

Journal of Materials Science

Volumn 42, Issue 13, 2007, Pages 5239-5247

  Zhong, W H ^a   Chan, Y C ^a   Wu, B Y ^a   Alam, M O ^a   Guan, J F ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b WUHAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

FRACTURE; GOLD ALLOYS; METALLIZING; MICROSTRUCTURE; SOLDERING ALLOYS; SURFACE PHENOMENA;

BALL GRID ARRAY (BGA); FRACTURE SURFACES; MULTIPLE REFLOW; MULTIPLE REFLOW SOLDERING;

SOLDERED JOINTS;

EID: 34547250248     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-006-1234-x     Document Type: Article

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