Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy

Journal of Materials Science: Materials in Electronics

Volumn 23, Issue 7, 2012, Pages 1427-1434

  Shafiq, I ^a   Chan, Y C ^a   Wong, N B ^a   Yung, Winco K C ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY EUTECTICS; COMPOSITE SOLDERS; EUTECTIC SOLDERS; ROD-SHAPED; SB-DOPED; SECOND PHASE; SN-9ZN SOLDER; THERMAL BEHAVIORS; WEIGHT PERCENTAGES;

ALLOYS; ANTIMONY COMPOUNDS; CERIUM ALLOYS; HARDNESS; METALLIC COMPOUNDS; MICROSTRUCTURE; NANOPARTICLES; TENSILE STRENGTH; TIN ALLOYS; ZINC;

TIN;

EID: 84863988062     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-011-0608-2     Document Type: Article

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