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Volumn 504, Issue 1-2, 2006, Pages 371-378

Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications

Author keywords

Microstructure; Solder alloys; SWCNTs; Tensile strength

Indexed keywords

CARBON NANOTUBES; COMPACTION; COMPOSITE MATERIALS; MICROSTRUCTURE; POWDER METALS; TENSILE STRENGTH;

EID: 33644928034     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.072     Document Type: Conference Paper
Times cited : (58)

References (22)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.