|
Volumn 504, Issue 1-2, 2006, Pages 371-378
|
Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications
|
Author keywords
Microstructure; Solder alloys; SWCNTs; Tensile strength
|
Indexed keywords
CARBON NANOTUBES;
COMPACTION;
COMPOSITE MATERIALS;
MICROSTRUCTURE;
POWDER METALS;
TENSILE STRENGTH;
MECHANICAL MIXING;
MICROSTRUCTURAL PROPERTIES;
SWCNT;
ULTRA-FINE PITCH;
SOLDERING ALLOYS;
|
EID: 33644928034
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2005.09.072 Document Type: Conference Paper |
Times cited : (58)
|
References (22)
|