Microstructural characteristics and vibration fracture properties of Sn-Ag-Cu-TM (TM = Co, Ni, and Zn) alloys

Journal of Electronic Materials

Volumn 35, Issue 12, 2006, Pages 2154-2163

  Song, Jenn Ming ^a   Huang, Chi Feng ^a   Chuang, Hsin Yi ^a  

^a NATIONAL DONG HWA UNIVERSITY   (Taiwan)

Author keywords

Lead free solder; Resonant vibration; Sn Ag Cu; Tensile properties; Transition metals

Indexed keywords

LEAD-FREE SOLDER; RESONANT VIBRATION; SN-AG-CU;

EUTECTICS; FRACTURE; INTERMETALLICS; MICROSTRUCTURE; TENSILE PROPERTIES; TRANSITION METALS; VIBRATIONS (MECHANICAL);

SOLDERING ALLOYS;

EID: 33846453285     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0326-3     Document Type: Conference Paper

References (32)

1. I.E. Anderson, B.A. Cook, J. Harringa, and R.L. Terpstra, JOM 54(6), 26 (2002).
2. G.S. Wable, S. Chada, B. Neal, and R.A. Fournelle, JOM 57(6), 38 (2005).
3. D.W. Henderson, T. Gosselin, A. Sarkhel, S.K. Kang, W.K. Choi, D.Y. Shih, C. Goldsmith, and K.J. Puttlitz, J. Mater. Res. 17, 2775 (2002).
4. D.R. Frear, J.W. Jang, J.K. Lin, and C. Zang, JOM 53(6), 28 (2001).
5. J. Zhao, L. Qi, X.M. Wang, and L. Wang, J. Alloys Compd. 375, 196 (2004).
6. P.T. Vianco and J.A. Rejent, J. Electron. Mater. 28, 1127 (1999).
7. A. Sharif and Y.C. Chan, Thin Solid Films 504, 431 (2006).
8. Z.G. Chen, Y.W. Shi, Z.D. Xia, and Y.F. Yen, J. Electron. Mater. 31, 1122 (2002).
9. C.M.L. Wu, D.Q. Yu, G.M.T. Law, and L. Wang, J. Mater. Res. 17, 3146 (2002).
10. B.L. Chen and G.Y. Li, Thin Solid Films 462-463, 395 (2004).
11. I.E. Anderson, J.C. Foley, B.A. Cook, J. Harringa, R.L. Terpstra, and O. Unal, J. Electron. Mater. 30, 1050 (2001).
12. I.E. Anderson, B.A. Cook, J. Harringa, and R.L. Terpstra, J. Electron. Mater. 31, 1166 (2002).
13. Y. Kariya, T. Hoso, T. Kimura, and S. Terashima, The Inter Society Conference on Thermal Phenomena (Piscataway, NJ: IEEE, 2004), pp. 103-108.
14. C.M. Chuang and K.L. Lin, J. Electron. Mater. 32, 1426 (2003).
15. C.M. Chuang, P.C. Shih, and K.L. Lin, J. Electron. Mater. 33, 1 (2004).
16. K.S. Kim, S.H. Huh, and K. Suganuma, Microelectron. Reliab. 43, 259 (2003).
17. S.K. Kang, D.Y. Shih, D. Leonard, D.W. Henderson, T. Gosselin, S. Cho, J. Yu, and W.K. Choi, JOM 56(6), 34 (2004).
18. S.K Kang, D. Leonard, D.Y. Shih, L. Gignac, D.W. Henderson, S. Cho, and J. Yu, J. Electron. Mater. 35, 479 (2006).
19. D.J. Lee, D.H. Baek, K.K. Lee, K.M. Lee, and Y.J. Seo, Z. Metallkd. 96, 148 (2005).
20. Q.J. Yang, H.L.J. Pang, Z.P. Wang, G.H. Lim, F.F. Yap, and R.M. Lin, Microelectron. Reliab. 40, 1097 (2000).
21. Y.B. Kim, H. Noguchi, and M. Amagai, Microelectron. Reliab. 46, 459 (2006).
22. R.F. Steidel, Jr., An Introduction to Mechanical Vibrations, 3rd ed. (Hoboken, NJ: John Wiley & Sons, 1989), p. 169.
23. L. Liu, C. Andersson, and J. Liu, J. Electron. Mater. 33, 935 (2004).
24. J.M. Song, G.P. Lan, T.S. Lui, and L.H, Chen, J. Alloys Compd. 379, 233 (2004).
25. J.M. Song, F.I. Li, T.S. Lui, and L.H. Chen, J. Mater. Res. 19, 2665 (2004).
26. A.U. Telang, T.R. Bieler, S. Choi, and K.N. Subramanian, J. Mater. Res. 17, 2294 (2002).
27. A.U. Telang, T.R. Bieler, J.P. Lucas, K.N. Subramanian, L.P. Lehman, Y. King, and E.J. Cotts, J. Electron. Mater. 33, 1412 (2004).
28. L.P. Lehman et al., J. Electron. Mater. 33, 1429 (2004).
29. A. LaLonde, D. Emelander, J. Jeannette, C. Larson, W. Rietz, D. Swenson, and D.W. Henderson, J. Electron. Mater. 33, 1545 (2004).
30. C.M. Chuang, T.S. Lui, L.H. Chen, and T.M. Yin, Mater. Trans. 42, 2064 (2001).
31. J.S. Koehler, Plastic Deformation in Crystallines Solids (Pittsburgh, PA: Mellon Institute, 1950), p. 216.
32. A. Granato and K. Lücke, J. Appl. Phys. 27, 583 (1956).