Thermodynamic prediction of interface phases at Cu/solder joints

Journal of Electronic Materials

Volumn 27, Issue 11, 1998, Pages 1161-1166

  Lee, Hyuck M O ^a   Yoon, Seung Wook ^a   Lee, Byeong Joo ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Korea Research Institute of Standards and Science   (South Korea)

Author keywords

CALPHAD method; Interfacial reaction; Intermetallic compound; Lead free solder; Thermodynamics

Indexed keywords

COPPER; INTERMETALLICS; PHASE EQUILIBRIA; PHASE INTERFACES; SOLDERED JOINTS; THERMODYNAMICS;

INTERFACIAL REACTIONS;

SOLDERING ALLOYS;

EID: 0032207153     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0065-8     Document Type: Article

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