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Volumn 17, Issue 2, 2002, Pages 291-301

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu

(9) Lee, T Y a Choi, W J a Tu, K N a Jang, J W b Kuo, S M b Lin, J K b Frear, D R b Zeng, K c Kivilahti, J K c

a University of California (United States)

b MOTOROLA INC (United States)

c AALTO UNIVERSITY (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; AGING OF MATERIALS; EUTECTICS; INTERMETALLICS; METALLIZING; MOLTEN MATERIALS; PHASE DIAGRAMS; REACTION KINETICS; TERNARY SYSTEMS; THERMODYNAMICS; WETTING;

SOLID-STATE AGING;

SOLDERING ALLOYS;

EID: 0036477480 PISSN: 08842914 EISSN: None Source Type: Journal
DOI: 10.1557/JMR.2002.0042 Document Type: Article

Times cited : (263)

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